5 Minute Epoxy Gels, 50 mL, Dev-Pak, Amber
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$210.97
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Devcon 5 Minute® Epoxy Gels Product Details: Thixotropic, nonmigrating gel adhesive with excellent gap filling properties High tensile strength Good solvent resistance Non-sagging adhesive Fills gaps to .25 inch Fast curing for bond tags on machinery and equipment Testing and Approvals: Chemical resistance was tested by immersion for 30 days at 75 °F, after 7 days room temperature cure; Cured hardness tested according to ASTM D-2240; Cured density tested according to ASTM D1002; Compression strength tested according to ASTM D695; Dielectric strength tested according to ASTM D149 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Specifications| Adhesive Tensile Shear |
2,500 psi |
Applicable Materials |
Wood; Most Metals; Ceramic; Fabric; Concrete; Stee |
Applications |
Multi-Purpose |
Big Catalog Page# |
2012:167 |
Brand |
DEVCON |
Capacity Vol. [Nom] |
50 mL |
Chemical Compound |
Epoxy |
Color |
Opaque |
Container Size |
50 mL |
Country of Origin |
US |
Dielectric Strength |
440 V/mil |
Fix Cure Time @ Temp. |
1 h @ 75 °F |
Full Cure Time @ Temp. |
16 h @ 75 °F |
Gap Fill [Nom] |
1/4 in |
Hardness [Nom] |
80 Shore D |
MPI Catalog |
YES |
MPI Catalog Page# |
2019:50 |
ORMD |
NO |
Packing Type |
Dev-Pak™ |
Prop 65 |
NO |
Resistance |
Kerosene; Sulfuric Acid-10%; Toluene; Hydrochloric |
Special Order |
NO |
Temp. Range [Max] |
200 °F |
Temp. Range [Min] |
-40 °F |
UNSPSC |
31201600 |
Viscosity [Nom] |
150,000 cP |
Working Time [Max] |
7 min |
Working Time [Min] |
4 min |
Working Time [Nom] |
4-7 min |
Wt. |
0.2 lb |
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