HP 250 Epoxy, 50 mL, Dev-Pak, Straw
Regular price
$20.75
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--->> This Price Buys You: 1 EA / EA
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Devcon HP 250 Epoxy Product Details: High-performance, gap-filling thixotropic paste for structural bonding applications Superior toughness, impact and chemical resistant Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics Excellent gap fill. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Specifications| Adhesive Tensile Shear |
3,200 psi |
Applicable Materials |
Aluminum; Brass; Copper; Galvanized Steel; Most Me |
Applications |
Multi-Purpose |
Base Type |
Epoxy |
Big Catalog Page# |
2012:172 |
Brand |
DEVCON |
Capacity Vol. [Nom] |
50 mL |
Chemical Compound |
Epoxy |
Color |
Straw |
Container Size |
50 mL |
Country of Origin |
US |
Dielectric Strength |
490 V/mil |
Elongation [Nom] |
25% |
Fix Cure Time @ Temp. |
6 h @ 72 °F |
Full Cure Time @ Temp. |
7 d @ 72 °F |
Hardness [Nom] |
78 Shore D |
Hazmat |
YES |
Height [Nom] |
3 1/4 in |
Length [Nom] |
7 1/4 in |
MPI Catalog Page# |
2019:51 |
Material |
Thixotropic Paste |
Odor/Scent |
Low |
Packing Type |
Dev-Pak™ |
Physical Form |
Solid |
Ratio |
2:1 |
Resistance |
Chlorinated Solvents; Kerosene; Moisture; Water; W |
Special Order |
NO |
Temp. Range [Max] |
250 °F |
Temp. Range [Min] |
-67 °F |
Tensile Strength [Nom] |
3,200 psi |
Type |
Adhesive |
Usage |
Structural Bonding |
Viscosity [Nom] |
105,000 cP |
Vol. |
50 mL |
Width [Nom] |
6 in |
Working Time [Nom] |
65 min |
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