HP 250 Epoxy, 400 mL, Cartridge, Straw

HP 250 Epoxy, 400 mL, Cartridge, Straw

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Devcon HP 250 Epoxy

Product Details:
High-performance, gap-filling thixotropic paste for structural bonding applications
Superior toughness, impact and chemical resistant
Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics
Excellent gap fill.
Specifications
Adhesive Tensile Shear 3,200 psi
Applicable Materials Aluminum; Brass; Copper; Galvanized Steel; Most Me
Application Temp. Range [Max] 250 °F
Application Temp. Range [Min] -67°F
Applications Multi-Purpose
Base Type Epoxy
Brand DEVCON
Capacity Vol. [Nom] 400 mL
Chemical Compound Epoxy
Color Straw
Container Size 400 mL
Country of Origin US
Dielectric Strength 490 V/mil
Elongation [Nom] 25%
Fix Cure Time @ Temp. 6 h @ 72°F
Flash Point [Nom] 200°F
Full Cure Time @ Temp. 7 d @ 72 °F
Hardness [Nom] 78 Shore D
Hazmat YES
MPI Catalog Page# 2019:51
Material Thixotropic Paste
Odor/Scent Low
Packing Type Cartridge
Physical Form Paste
Ratio 2:1
Resistance Chlorinated Solvents; Kerosene; Moisture; Water; W
Specific Gravity [Nom] 1.0
Temp. Range [Max] 250 °F
Temp. Range [Min] -67 °F
Tensile Strength [Nom] 3,200 psi
Type Adhesive
Usage Structural Bonding
Viscosity [Nom] Resin: 120,000 cP; Hardener: 75,000 cP
Vol. 400 mL
Width [Nom] 400mL
Working Time [Nom] 65 min